Patent Assignment
Reel/Frame 044741/0010
Assignment of Assignor's Interest
Recorded: 2018-01-26
Pages: 3
Assignors
YU, TA-JEN
Executed: 2018-01-22
CHEN, CHI-YUAN
Executed: 2018-01-22
HSU, WEN-SUNG
Executed: 2018-01-22
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Package with Rigid Under Bump Metallurgy (Ubm) Stack