Patent Assignment
Reel/Frame 044751/0391
Assignment of Assignor's Interest
Recorded: 2018-01-29
Pages: 6
Assignors
YOON, CHAN-SIC
Executed: 2017-10-19
LEE, HO-IN
Executed: 2017-10-18
LEE, KI-SEOK
Executed: 2017-10-23
PARK, JE-MIN
Executed: 2017-10-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same