Patent Assignment
Reel/Frame 044757/0165
Assignment of Assignor's Interest
Recorded: 2018-01-29
Pages: 3
Assignors
TSAI, PO-HAO
Executed: 2018-01-22
CHUANG, PO-YAO
Executed: 2018-01-22
JENG, SHIN-PUU
Executed: 2018-01-22
WONG, TECHI
Executed: 2018-01-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Heterogeneous Fan-Out Structure and Method of Manufacture