Patent Assignment
Reel/Frame 044757/0285
Assignment of Assignor's Interest
Recorded: 2018-01-29
Pages: 5
Assignors
BAEK, YONG HO
Executed: 2018-01-25
JUNG, JOO HWAN
Executed: 2018-01-25
HUR, YOUNG SIK
Executed: 2018-01-25
GONG, JUNG CHUL
Executed: 2018-01-25
KIM, HAN
Executed: 2018-01-25
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.