IP Library › Assignment 044763/0459
Patent Assignment
Reel/Frame 044763/0459

Assignment of Assignor's Interest

Recorded: 2018-01-30 Pages: 2
Assignor
MULTEK TECHNOLOGIES LIMITED
Executed: 2018-01-30
Assignee
FLEX LTD
2 CHANGI SOUTH LANE, SINGAPORE, 486123, SINGAPORE
Covered Properties (5)
Self-Decap Cavity Fabrication Process and Structure
Patent: 9,999,134 →
Application: 15/081,623 →
Publication: US US20170265298A1
Embedding an Electronic Component Between Surfaces of a Printed Circuit Board
Patent: 7,782,629 →
Application: 11/828,196 →
Publication: US US20080202799A1
Inlay Pcb with Embedded Coin Board
Patent: 9,668,336 →
Application: 13/897,253 →
Embedded Coins for Hdi or Seq Laminations
Patent: 9,661,738 →
Application: 14/476,549 →
Embedded Components in a Substrate
Patent: 9,521,754 →
Application: 14/463,361 →
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 10, 2007
From: GRAYDON, BHRET; SHU, WILLIAM KUANG-HUA
To: FLEXTRONICS AP, LLC
Reel/Frame 019942/0471 →
Assignment of Assignor's Interest May 17, 2013
From: JACOBSSON, HENRIK
To: FLEXTRONICS AP, LLC
Reel/Frame 030451/0351 →
Assignment of Assignor's Interest Aug 19, 2014
From: BERGMAN, MARK; SHANG, SHURUI; VRTIS, JOAN K.
To: FLEXTRONICS AP, LLC
Reel/Frame 033566/0386 →
Assignment of Assignor's Interest Sep 3, 2014
From: JACOBSSON, HENRIK; YU, PUI YIN
To: FLEXTRONICS AP, LLC
Reel/Frame 033662/0268 →
Assignment of Assignor's Interest Mar 25, 2016
From: ZHANG, MARK; PEN, KWAN; YU, PUI YIN
To: MULTEK TECHNOLOGIES LIMITED
Reel/Frame 038105/0466 →
Assignment of Assignor's Interest Oct 31, 2016
From: BERGMAN, MARK; VRTIS, JOAN K.
To: MULTEK TECHNOLOGIES LIMITED
Reel/Frame 040178/0764 →
Assignment of Assignor's Interest May 15, 2017
From: FLEXTRONICS AP, LLC
To: MULTEK TECHNOLOGIES LIMITED
Reel/Frame 042382/0045 →