Self-decap cavity fabrication process and structure
View Patent ↗A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask frame, and a protective film. The solder mask frame and protective film protect inner core circuitry at the bottom of the cavity during the fabrication process, as well as enable the use of regular flow prepreg in the laminated stack.
1. A printed circuit board comprising: a. a laminated stack comprising a plurality of non-conductive layers and a plurality of conductive layers, wherein a recessed cavity is formed in the laminated stack, the recessed cavity having cavity side walls and a cavity bottom surface, further wherein inner core circuitry is formed on the cavity bottom surface; b. a photo imageable polymer structure formed within the laminated stack, wherein the photo imageable polymer structure is a solder mask frame, further wherein the photo imageable polymer structure forms a perimeter boundary of the recessed cavity within the cavity side walls adjacent to the cavity bottom surface; and c. a protective film on the photo imageable polymer structure and formed within the laminated stack.
2. The printed circuit board of claim 1 wherein the recessed cavity is formed from an outer surface of the laminated stack into the laminated stack.
3. The printed circuit board of claim 1 wherein the photo imageable polymer structure is formed on a surface of one of the plurality of conductive layers.
4. The printed circuit board of claim 3 wherein the one of the plurality of conductive layers on which the photo imageable polymer structure is formed comprises a first portion on which the photo imageable polymer structure is formed and a second portion comprising the inner core circuitry.
5. The printed circuit board of claim 1 wherein the protective film is polyimide.
6. The printed circuit board of claim 1 wherein one or more of the plurality of non-conductive layers comprise a prepreg layer.
7. The printed circuit board of claim 6 wherein the prepreg layer comprises a regular flow prepreg layer having resin flow greater than about 100 mil.
8. The printed circuit board of claim 1 wherein each of the conductive layers is pattern etched.
9. The printed circuit board of claim 1 further comprising one or more plated through hole vias in the laminated stack.
10. The printed circuit board of claim 1 wherein the protective film is stacked on the photo imageable polymer structure and within the cavity side walls adjacent to the cavity.
11. A printed circuit board comprising:
a. a laminated stack comprising a plurality of non-conductive layers and a plurality of conductive layers, wherein a recessed cavity is formed in the laminated stack, the recessed cavity having cavity side walls and a cavity bottom surface, further wherein inner core circuitry is formed on the cavity bottom surface;
b. a photo imageable polymer structure formed within the laminated stack, wherein the photo imageable structure forms a perimeter boundary of the recessed cavity within the cavity side walls adjacent to the cavity bottom surface, further wherein the photo imageable polymer structure is formed on a surface of one of the plurality of conductive layers; and
c. a protective film on the photo imageable polymer structure and formed within the laminated stack.
12. The printed circuit board of claim 11 wherein the recessed cavity is formed from an outer surface of the laminated stack into the laminated stack.
13. The printed circuit board of claim 11 wherein the one of the plurality of conductive layers on which the photo imageable polymer structure is formed comprises a first portion on which the photo imageable polymer structure is formed and a second portion comprising the inner core circuitry.
14. The printed circuit board of claim 11 wherein the protective film is polyimide.
15. The printed circuit board of claim 11 wherein one or more of the plurality of non-conductive layers comprise a prepreg layer.
16. The printed circuit board of claim 11 wherein the prepreg layer comprises a regular flow prepreg layer having resin flow greater than about 100 mil.
17. The printed circuit board of claim 11 wherein each of the conductive layers is pattern etched.
18. The printed circuit board of claim 11 further comprising one or more plated through hole vias in the laminated stack.
19. The printed circuit board of claim 11 wherein the protective film is stacked on the photo imageable polymer structure and within the cavity side walls adjacent to the cavity.