Patent Assignment
Reel/Frame 044767/0269
Assignment of Assignor's Interest
Recorded: 2018-01-30
Pages: 4
Assignors
JENG, SHIN-PUU
Executed: 2018-01-22
TSAI, PO-HAO
Executed: 2018-01-22
CHUANG, PO-YAO
Executed: 2018-01-22
HSU, FENG-CHENG
Executed: 2018-01-22
CHEN, SHUO-MAO
Executed: 2018-01-22
WONG, TECHI
Executed: 2018-01-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Chip Package with Recessed Interposer Substrate