Patent Assignment
Reel/Frame 044768/0117
Assignment of Assignor's Interest
Recorded: 2018-01-30
Pages: 6
Assignors
TOMIZAWA, KAZUYUKI
Executed: 2017-12-28
KIKUCHI, MASASHI
Executed: 2017-12-28
ISHIKAWA, MICHIO
Executed: 2017-12-28
TAKAHASHI, NAOKI
Executed: 2017-12-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Loading Apparatus and Film Forming Apparatus