Patent Assignment
Reel/Frame 044779/0159
Assignment of Assignor's Interest
Recorded: 2018-01-30
Pages: 4
Assignors
CHEN, JIE
Executed: 2018-01-19
CHEN, HSIEN-WEI
Executed: 2018-01-19
LIU, TZUAN-HORNG
Executed: 2018-01-19
CHEN, YING-JU
Executed: 2018-01-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Mask Assembly and Method for Fabricating a Chip Package