Patent Assignment
Reel/Frame 044784/0265
Assignment of Assignor's Interest
Recorded: 2018-01-31
Pages: 4
Assignors
CHEN, YI
Executed: 2018-01-26
YEH, CHANG-LIN
Executed: 2018-01-26
KAO, JEN-CHIEH
Executed: 2018-01-26
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Device and Method of Manufacturing the Same