Patent Assignment
Reel/Frame 044784/0649
Assignment of Assignor's Interest
Recorded: 2018-01-31
Pages: 6
Assignors
YOON, CHAN-SIC
Executed: 2017-10-19
LEE, KI-SEOK
Executed: 2017-10-23
KIM, JUNG-HYUN
Executed: 2017-10-18
PARK, JE-MIN
Executed: 2017-10-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Contact Structure