Patent Assignment
Reel/Frame 044793/0372
Assignment of Assignor's Interest
Recorded: 2018-01-31
Pages: 10
Assignors
LIU, WEI-HSIN
Executed: 2018-01-30
HUANG, CHENG-HSU
Executed: 2018-01-30
LEE, JUI-MIN
Executed: 2018-01-30
CHEN, YI-WEI
Executed: 2018-01-30
Assignees
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD.
NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY, QUANZHOU CITY, FUJIAN PROVINCE, CHINA
Covered Property
(1)
Semiconductor Memory Device and Manufacturing Method Thereof