Patent Assignment
Reel/Frame 044796/0659
Assignment of Assignor's Interest
Recorded: 2018-02-01
Pages: 2
Assignors
CHEN, MING-FA
Executed: 2018-01-15
CHEN, HSIEN-WEI
Executed: 2018-01-15
YEH, SUNG-FENG
Executed: 2018-01-15
CHIOU, WEN-CHIH
Executed: 2018-01-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Forming Metal Bonds with Recesses