Patent Assignment
Reel/Frame 044827/0265
Assignment of Assignor's Interest
Recorded: 2018-02-05
Pages: 3
Assignor
LIN, HSIANG-WEI
Executed: 2016-09-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnection Structure Having Air Gap