Patent Assignment
Reel/Frame 044831/0666
Assignment of Assignor's Interest
Recorded: 2018-02-05
Pages: 3
Assignor
BEYNE, ERIC
Executed: 2017-12-14
Assignee
IMEC VZW
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Semiconductor Die Package and Method of Producing the Package