Patent Assignment
Reel/Frame 044839/0293
Assignment of Assignor's Interest
Recorded: 2018-02-06
Pages: 3
Assignor
MORIYAMA, TERUMASA
Executed: 2017-12-13
Assignee
JX NIPPON MINING & METALS CORPORATION
1-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 1008164, JAPAN
Covered Property
(1)
Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus