Patent Assignment
Reel/Frame 044873/0105
Assignment of Assignor's Interest
Recorded: 2018-02-08
Pages: 7
Assignors
KUWAKO, FUJIO
Executed: 2016-07-06
MATSUSHIMA, TOSHIFUMI
Executed: 2016-06-08
HOSOI, TOSHIHIRO
Executed: 2016-06-08
Assignee
MITSUI MINING & SMELTING CO., LTD.
1-11 OSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, 141-8584, JAPAN
Covered Property
(1)
Copper Clad Laminate for Forming of Embedded Capacitor Layer, Multilayered Printed Wiring Board, and Manufacturing Method of Multilayered Printed Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.