Patent Assignment
Reel/Frame 044879/0865
Assignment of Assignor's Interest
Recorded: 2018-02-09
Pages: 9
Assignors
GAO, JIAN
Executed: 2018-01-08
GAO, HONGPO
Executed: 2018-01-08
HAN, GENG
Executed: 2018-01-09
DONG, JIBING
Executed: 2018-01-08
XU, XINLEI
Executed: 2018-01-05
Assignee
EMC IP HOLDING COMPANY LLC
176 SOUTH STREET, HOPKINTON, MASSACHUSETTS, 01748
Covered Property
(1)
Microelectronic Package with Horizontal and Vertical Interconnections
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 16, 2017
From: UZOH, CYPRIAN EMEKA; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 041599/0990 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →