Patent Assignment
Reel/Frame 044960/0877
Assignment of Assignor's Interest
Recorded: 2017-12-26
Pages: 6
Assignors
JEON, KYUNG YUB
Executed: 2017-12-18
JEONG, SOO YEON
Executed: 2017-12-18
CHOI, JAE KWANG
Executed: 2017-12-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same