Patent Assignment
Reel/Frame 044964/0950
Assignment of Assignor's Interest
Recorded: 2018-02-19
Pages: 6
Assignors
FOO, SIANG SIN
Executed: 2018-01-05
KOSUGI, HIROMITSU
Executed: 2018-01-05
NARAG, ALEJANDRO ALDRIN A., II
Executed: 2018-01-08
PALANISWAMY, RAVI
Executed: 2018-01-05
Assignee
3M INNOVATIVE PROPERTIES COMPANY
P.O. BOX 33427, SAINT PAUL, MINNESOTA, 55133-3427
Covered Property
(1)
Fiducial Mark for Chip Bonding