Patent Assignment
Reel/Frame 044977/0926
Assignment of Assignor's Interest
Recorded: 2018-02-20
Pages: 3
Assignors
TSUYUNO, NOBUTAKE
Executed: 2018-01-16
TOKUYAMA, TAKESHI
Executed: 2018-01-23
IDE, EIICHI
Executed: 2018-01-17
Assignee
HITACHI AUTOMOTIVE SYSTEMS, LTD.
2520, TAKABA, HITACHINAKA-SHI, IBARAKI, JAPAN
Covered Property
(1)
Power Semiconductor Module with Heat Dissipation Plate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.