Patent Assignment
Reel/Frame 044997/0184
Assignment of Assignor's Interest
Recorded: 2018-02-22
Pages: 2
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Manufacturing Method of Semiconductor Device and Semiconductor Device