Patent Assignment
Reel/Frame 045015/0190
Assignment of Assignor's Interest
Recorded: 2018-02-23
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Structure and Fabrication Method Thereof