IP Library › Assignment 045025/0032
Patent Assignment
Reel/Frame 045025/0032

Assignment of Assignor's Interest

Recorded: 2018-02-23 Pages: 5
Assignors
TIAN, HONGWEI
Executed: 2017-11-29
NIU, YANAN
Executed: 2017-11-29
Assignee
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO ROAD, CHAOYANG DISCTRICT, BEIJING, 100015, CHINA
Covered Property (1)
Oled Package Substrate Having a Conductor Attached to Electrode on an Array Substrate
Application: 15/755,034 →
Publication: US 2020/0235329