Patent Assignment
Reel/Frame 045037/0322
Assignment of Assignor's Interest
Recorded: 2018-02-26
Pages: 3
Assignors
CHUANG, CHITA
Executed: 2011-07-20
CHUANG, YAO-CHUN
Executed: 2011-07-20
LIN, TSUNG-SHU
Executed: 2011-07-20
KUO, CHEN-CHENG
Executed: 2011-07-20
CHEN, CHEN-SHIEN
Executed: 2011-07-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Packaging Assembly and Method of Making the Same