Patent Assignment
Reel/Frame 045049/0248
Assignment of Assignor's Interest
Recorded: 2018-02-27
Pages: 4
Assignors
WEI, YU-CHEN
Executed: 2018-02-13
SU, JHENG-SI
Executed: 2018-02-13
LIN, SHIH-HO
Executed: 2018-02-13
LAI, JEN-CHIEH
Executed: 2018-02-13
CHAN, CHUN-CHIEH
Executed: 2018-02-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chemical Mechanical Polishing Apparatus and Method