Patent Assignment
Reel/Frame 045070/0438
Assignment of Assignor's Interest
Recorded: 2018-02-28
Pages: 2
Assignors
SEKIKAWA, HIROAKI
Executed: 2017-11-27
TOKUMITSU, SHIGEO
Executed: 2017-11-27
KOMURO, ASUKA
Executed: 2017-11-27
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device Including a Substrate Contact Plug and Manufacturing Method Thereof