Patent Assignment
Reel/Frame 045082/0546
Assignment of Assignor's Interest
Recorded: 2018-03-01
Pages: 12
Assignors
CHENG, YU-WEN
Executed: 2017-12-08
LOH, WEI-YIP
Executed: 2017-12-08
LIAO, YU-HSIANG
Executed: 2017-12-11
LIN, SHENG-HSUAN
Executed: 2017-12-08
LEE, HONG-MAO
Executed: 2017-12-08
TSAI, CHUN-I
Executed: 2017-12-08
CHANG, KEN-YU
Executed: 2017-12-08
LIN, WEI-JUNG
Executed: 2017-12-08
CHANG, CHIH-WEI
Executed: 2017-12-07
TSAI, MING-HSING
Executed: 2017-12-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN 6TH RD., HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Contact Structure and the Method of Forming the Same