Patent Assignment
Reel/Frame 045100/0891
Assignment of Assignor's Interest
Recorded: 2018-03-04
Pages: 6
Assignors
CHIANG, YUNG-PING
Executed: 2017-06-09
SHIH, CHAO-WEN
Executed: 2017-06-09
HSIAO, MIN-CHIEN
Executed: 2017-06-09
WU, NIEN-FANG
Executed: 2017-06-09
CHANG, SHOU-ZEN
Executed: 2018-01-04
CHIANG, YI-CHE
Executed: 2017-06-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same