Patent Assignment
Reel/Frame 045107/0239
Assignment of Assignor's Interest
Recorded: 2018-03-05
Pages: 3
Assignors
WU, CHIH-WEI
Executed: 2013-09-23
SHIH, YING-CHING
Executed: 2013-09-23
LU, SZU-WEI
Executed: 2013-09-23
LIN, JING-CHENG
Executed: 2013-09-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Three Dimensional Integrated Circuit (3DIC) with Support Structures