Patent Assignment
Reel/Frame 045130/0181
Assignment of Assignor's Interest
Recorded: 2018-03-07
Pages: 7
Assignors
LEE, KEUN
Executed: 2018-01-25
LEE, JEONG GIL
Executed: 2018-01-29
KIM, DO HYUNG
Executed: 2018-01-29
YOON, KI HYUN
Executed: 2018-01-29
LIM, HYUN SEOK
Executed: 2018-01-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices and Method of Forming the Same