IP Library › Assignment 045132/0724
Patent Assignment
Reel/Frame 045132/0724

Assignment of Assignor's Interest

Recorded: 2018-03-07 Pages: 2
Assignor
Assignee
SHARP KABUSHIKI KAISHA
1 TAKUMI-CHO, SAKAI-KU, SAKAI CITY, OSAKA, 590-8522, JAPAN
Covered Property (1)
Substrate Features for Enhanced Fluidic Assembly of Electronic Devices
Application: 15/859,672 →
Publication: US 2018/0145207
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 5, 2018
From: HEINE, DAVID; GARNER, SEAN MATHEW; SHINDE, AVINASH TUKARAM
To: SHARP LABORATORIES OF AMERICA, INC.
Reel/Frame 045110/0126 →
Assignment of Assignor's Interest Apr 18, 2018
From: SHARP KABUSHIKI KAISHA
To: ELUX INC.
Reel/Frame 045579/0076 →