Patent Assignment
Reel/Frame 045137/0630
Assignment of Assignor's Interest
Recorded: 2018-03-07
Pages: 5
Assignors
CHEN, TSAN-HSIEN
Executed: 2017-11-16
HU, IAN
Executed: 2017-11-16
YANG, JIN-FENG
Executed: 2017-11-16
CHEN, SHIH-WEI
Executed: 2017-11-24
HSU, HUI-CHEN
Executed: 2017-11-16
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method for Manufacturing the Same