Patent Assignment
Reel/Frame 045150/0797
Assignment of Assignor's Interest
Recorded: 2018-03-08
Pages: 4
Assignors
CHEN, WEI-CHIH
Executed: 2018-02-02
KUO, HUNG-JUI
Executed: 2018-02-02
HU, YU-HSIANG
Executed: 2018-02-02
LIAO, SIH-HAO
Executed: 2018-02-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same