Patent Assignment
Reel/Frame 045174/0847
Assignment of Assignor's Interest
Recorded: 2018-03-12
Pages: 4
Assignors
TAKEMURA, KATSUYA
Executed: 2018-01-29
URANO, HIROYUKI
Executed: 2018-01-29
IIO, MASASHI
Executed: 2018-01-29
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Polymer of Polyimide Precursor, Positive Type Photosensitive Resin Composition, Negative Type Photosensitive Resin Composition, Patterning Process, Method for Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, and Electronic Parts