Patent Assignment
Reel/Frame 045236/0197
Assignment of Assignor's Interest
Recorded: 2018-03-15
Pages: 6
Assignors
SHIN, MISO
Executed: 2018-02-14
KWON, MYEONGAN
Executed: 2018-02-14
MIN, CHUNGKI
Executed: 2018-02-14
KWON, BYOUNGHO
Executed: 2018-02-14
YOON, BOUN
Executed: 2018-02-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO,, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Device and Method of Fabricating the Same