Patent Assignment
Reel/Frame 045251/0319
Assignment of Assignor's Interest
Recorded: 2018-03-16
Pages: 3
Assignors
ORI, YUKI
Executed: 2017-12-13
ARAI, HIDETA
Executed: 2017-12-13
MIKI, ATSUSHI
Executed: 2017-12-13
FUKUCHI, RYO
Executed: 2017-12-13
Assignee
JX NIPPON MINING & METALS CORPORATION
1-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8164, JAPAN
Covered Property
(1)
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device