Patent Assignment
Reel/Frame 045275/0954
Assignment of Assignor's Interest
Recorded: 2018-03-19
Pages: 6
Assignors
HIGGINS, LEO M., III
Executed: 2017-09-27
BRAUCHLER, FRED T.
Executed: 2017-09-27
CARPENTER, BURTON JESSE
Executed: 2017-10-03
LIU, JINMEI
Executed: 2017-09-28
CHING, MARIANO LAYSON, JR.
Executed: 2017-09-28
YAO, JINZHONG
Executed: 2017-09-28
PANG, XINGSHOU
Executed: 2017-09-28
WANG, JIANHONG
Executed: 2017-09-28
WEI, YADONG
Executed: 2017-09-28
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, OE:62, AUSTIN, TEXAS, 78735
Covered Property
(1)
Packaged Integrated Circuit Having Stacked Die and Method for Therefor