Patent Assignment
Reel/Frame 045277/0231
Assignment of Assignor's Interest
Recorded: 2018-03-19
Pages: 6
Assignors
CHEN, CHEN-SHIEN
Executed: 2017-12-26
LIN, HSIU-JEN
Executed: 2017-12-26
YEW, MING-CHIH
Executed: 2017-12-26
CHENG, MING-DA
Executed: 2017-08-31
LAI, YI-JEN
Executed: 2017-12-26
SU, YU-TSE
Executed: 2017-12-26
SUN, SEY-PING
Executed: 2018-01-17
CHEN, YANG-CHE
Executed: 2017-08-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages having Dummy Connectors and Methods of Forming Same