IP Library › Assignment 045299/0077
Patent Assignment
Reel/Frame 045299/0077

Assignment of Assignor's Interest

Recorded: 2018-03-21 Pages: 6
Assignors
LIAO, WEN-SHIANG
Executed: 2018-03-16
KUO, FENG WEI
Executed: 2018-03-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
3D Ic Antenna Array with Laminated High-K Dielectric
Application: 15/904,758 →
Publication: US 2019/0103680