Patent Assignment
Reel/Frame 045314/0181
Assignment of Assignor's Interest
Recorded: 2018-03-22
Pages: 5
Assignors
YU, CHIA-TA
Executed: 2017-09-15
LEE, KAI-HSUAN
Executed: 2017-09-15
CHEN, YEN-MING
Executed: 2017-09-15
CHUI, CHI ON
Executed: 2017-09-20
YEONG, SAI-HOOI
Executed: 2017-09-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure for Semiconductor Device and Methods of Fabrication Thereof