Patent Assignment
Reel/Frame 045314/0744
Assignment of Assignor's Interest
Recorded: 2018-03-22
Pages: 3
Assignors
TOMIKAWA, MITSUHIRO
Executed: 2018-02-01
TSUNODA, KOICHI
Executed: 2018-02-01
YOSHIKAWA, KAZUHIRO
Executed: 2018-02-08
YOSHIDA, KENICHI
Executed: 2018-02-01
Assignee
TDK CORPORATION
3-9-1, SHIBAURA, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Property
(1)
Electronic Component Embedded Substrate