Patent Assignment
Reel/Frame 045315/0838
Assignment of Assignor's Interest
Recorded: 2018-03-22
Pages: 4
Assignee
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
3-1-1 KYOBASHI, CHUO-KU, TOKYO, 104-0031, JAPAN
Covered Property
(1)
Ultrasonic Vibration Bonding Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.