Ultrasonic vibration bonding apparatus

1. An ultrasonic vibration bonding apparatus, comprising:

a substrate table on which a substrate is disposed;

a bonding tool executing an ultrasonic vibration processing of applying ultrasonic vibration to an application portion on a lead wire having conductivity from a direct contact tip portion while applying predetermined pressure on a side of the substrate table in a state where the lead wire is disposed on the substrate; and

first and second press mechanisms including first and second press rollers capable of performing a rotational operation, wherein

the first and second press mechanisms execute

a press processing of pressing both sides of the application portion on the lead wire by the first and second press rollers at a time of execution of the ultrasonic vibration processing by the bonding tool, and

a movement processing of executing a rotational operation performed by the first and second press rollers to move the first and second press rollers on the lead wire while pressing the lead wire at a time of non-execution of the ultrasonic vibration processing by the bonding tool,

the bonding tool and the first and second press mechanisms are physically connected,

a contact state between the bonding tool and the lead wire is released during the execution of the movement processing,

an extension direction of the lead wire is a predetermined direction,

the bonding tool and the first and second press rollers are disposed along the predetermined direction, and

the first and second press rollers are moved along the predetermined direction during the execution of the movement processing.

2. The ultrasonic vibration bonding apparatus according to claim 1 , further comprising

a controller controlling the first and second press mechanisms, wherein

the controller variably controls pressing force by the first and second press rollers.