IP Library › Assignment 045322/0159
Patent Assignment
Reel/Frame 045322/0159

Assignment of Assignor's Interest

Recorded: 2018-03-22 Pages: 3
Assignor
LIAW, JHON-JHY
Executed: 2018-03-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property (1)
Semiconductor Device Having Fin Structures of Varying Dimensions
Application: 15/924,262 →
Publication: US 2019/0287967
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 22, 2018
From: LIAW, JHON-JHY
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 045321/0824 →