Patent Assignment
Reel/Frame 045325/0453
Assignment of Assignor's Interest
Recorded: 2018-03-23
Pages: 5
Assignors
GOH, ENG HUAT
Executed: 2018-01-02
LIM, MIN SUET
Executed: 2018-01-02
SIR, JIUN HANN
Executed: 2018-01-02
TEOH, HOAY TIEN
Executed: 2018-01-02
HUANG, JIMMY HUAT SINCE
Executed: 2018-01-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Electronic Package with Passive Component Between Substrates