IP Library Assignment 045329/0137
Patent Assignment
Reel/Frame 045329/0137

Assignment of Assignor's Interest

Recorded: 2018-03-23 Pages: 3
Assignors
MIYAKAWA, TAKESHI
Executed: 2018-02-08
KINO, MOTONORI
Executed: 2018-02-13
Assignee
DENKA COMPANY LIMITED
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO, 103-8338, JAPAN
Covered Property (1)
Heat-Dissipating Component and Method for Manufacturing Same
Application: 15/322,494 →
Publication: US 2017/0142859