Patent Assignment
Reel/Frame 045352/0494
Assignment of Assignor's Interest
Recorded: 2018-03-26
Pages: 5
Assignors
SATO, FUMIAKI
Executed: 2018-03-19
HIROKAWA, SUGURU
Executed: 2018-03-19
SHINOZUKA, MASAMITSU
Executed: 2018-03-19
Assignee
SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.
1-1, OSAKI 2-CHOME, SHINAGAWA-KU, TOKYO, 141-6025, JAPAN
Covered Property
(1)
Wafer Holding Device and Wafer Chucking and Dechucking Method