Patent Assignment
Reel/Frame 045364/0539
Assignment of Assignor's Interest
Recorded: 2018-03-28
Pages: 3
Assignor
LEE, CHI-FENG
Executed: 2017-11-23
Assignee
EYS3D MICROELECTRONICS, CO.
2F., NO.22, LN. 35, JIHU RD., NEIHU DIST., TAIPEI CITY, TAIWAN
Covered Property
(1)
Depth Map Generation Device for Merging Multiple Depth Maps