Patent Assignment
Reel/Frame 045379/0643
Assignment of Assignor's Interest
Recorded: 2018-03-28
Pages: 5
Assignors
HSIAO, HSU-LIANG
Executed: 2018-01-30
TSAI, YU-HSUAN
Executed: 2018-01-30
HUANG, PU SHAN
Executed: 2018-01-30
HUANG, CHING-HAN
Executed: 2018-01-30
LAI, LU-MING
Executed: 2018-01-30
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Microelectromechanical Systems Package Structure